Board thickness:0.14mm
Dimension:88*57.64mm
Raw material:double sided, RD copper without AD
Copper thickness on the board surface:20um
Copper thickness in the hole barrel:9um
Min.line width/space:0.05mm
Minimum hole diameter:0.2mm
Surface finishing:immersion gold≥1u"
Application:mobilephone module
We reserves 200,000Sqft capacity in our FPC operation for high volume demand from consumer electronics market.
We have customized VCP plating line,Tektronix DSA8300 impedance tester and guarantee impedance control ±8%
We have in-house SMT lines and provide one-stop FPC solutions
We provide in-house 24 hours salt spray testing for special requirement from specific markets.