Board thickness:2.0mm
Dimension:261*180.98mm
Raw material:FR4 EM825
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.1mm
Surface finishing:immersion gold≥2u"
Pitch: P0.9
Application:LED
Our customized solution can meet tight dimensional spec of ±0.05mm
We process copper filling for blind via with advanced DVCP lines to prevent bubbling inside the filled blind via.
Our leading edge technology of 3+8+3 stack via powers up the functional performance of your products.
min. line width/space: 0.075mm,
drilling depth tolerance: ±0.15mm.