Board thickness:1.0mm
Dimension:300*300mm
Raw material:Aluminium base+FR4, thermal conductivity 2.0w/mk
Copper thickness on the board surface:≥45um
Copper thickness in the hole barrel:20um
Min.line width/space:0.25mm
Minimum hole diameter:0.3mm
Surface finishing:immersion gold≥1u"
Application:illumination
High speed routing + double edged milling cutter for better PCB profiling.
Advanced material designed for LED illumination with thermal conductivity: 2.0W/m.K and dielectric thickness: 120um.
Unique SLPS ERP system enables us to monitor entire production process in the palm.