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Prepreg PCB printed circuit board M04C33269
for communication module4-layers

Prepreg PCB printed circuit board - M04C33269 - Sun and Lynn Circuits - for communication module / 4-layers

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Characteristics

Options: prepreg PCB
Applications: for communication module
Number of layers: 4-layers

Description

Board thickness：1.6mm Dimension：118*57.5mm Raw material：PTFE+FR4 Copper thickness on the board surface：56um Copper thickness in the hole barrel：25um Min.line width/space：0.20mm Minimum hole diameter：0.25mm Surface finishing：immersion gold≥1u" Application：Communication Our specialized Burkle pressing machine and Hitachi drilling machine provide excellent accuracy of lamination pressing temperature curve and via roughness for better consistency performance of high frequency application. We have customized plasma desmear machine and VCP plating line to provide excellent uniformity of barrel copper thickness. Our leading PCB manufacturing process can meet customer's design of stepping blind slot with dimensional tolerance of +/-0.10mm