10 layers printed circuit board S10C31828

Board thickness：1.6mm Dimension：161*94.88mm Raw material：FR4 IT180A Copper thickness on the board surface：≥35um Copper thickness in the hole barrel：20um Min.line width/space：0.05mm Minimum hole diameter：0.1mm Surface finishing：immersion gold≥1u" Application：GPS Advanced LDI machine can meet your strict spec of line width/space 0.05mm and hole positioning accuracy of ±0.05mm. Leading edge technology: min. BGA pad: 0.2mm; matt black solder mask; min solder mask dam: 0.1mm. Imported Tektronix DSA8200 impedance tester. IPC class III standard compliant. SLPS ERP system enables us to provide quick-turn delivery for time-critical applications: 5-day lead time for sample and 7-day lead time for volume production.