Board thickness:2.0mm
Dimension:209*148mm
Raw material:copper base
Copper thickness on the board surface:≥70um
Copper thickness in the hole barrel:25um
Min.line width/space:0.22mm
Minimum hole diameter:0.4mm
Surface finishing:immersion gold≥1u"
Application:power supply
High speed routing + double edged milling cutter for better PCB profiling.
Customized extra thick copper-based material.
Our specialized Burkle pressing machine provides excellent accuracy of lamination pressing temperature curve and prevents resin over-flowing for better high voltage performance.