Monocrystalline silicon solar panel EN_STP565-585S-C72-Nsh+

CEISOIEC

Large format 210 mm silicon wafers with the module efficiency up to 21.6% Based on 210 mm large format silicon wafer and PERC monocrystalline cell, increase light receiving area by 80.5% compared with 156mm cell, the conversion efficiency is greatly improved. With Suntech’s non-destructive cutting technology, avoid the damage of cutting surface, realize the optimal half-cell design, and reduce the current loss and the risk of hot spot. MBB technology + High-density packaging technology, the maximum power breaks through 670 W With multi-busbar technology, the transverse propagation path of the current decreases by 50%, reduce resistance loss effectively, realize the maximum power output, meanwhile, and assure the reliability of the module. Suntech adopts high-density packaging technology on Ultra X module, which can shorten distance between the cells and decrease the invalid power generation area greatly, and improves the energy density of the module. The upgraded high efficiency welding strip, lead to more second time refection of oblique light, increase the power generation by 1.57%. With the unique layout design, the weight of module is reduced by 20% Suntech has particularly optimized structure design, with exclusive patent, module weighs 31.5 KG,It has super mechanical load capacity and the load can reach up to +5400/-2400 Pa,the maximum deformation is reduced by 37%, then avoid the risk of micro crack loss.