CE solar module STP555S_C72_Vmh

ISOIEC

Large format 182 mm silicon wafers with module efficiency up to 21.5% Suntech Ultra V module adopts 182 mm silicon wafer, increases the wafer size, optimizes the layout profoundly and decreases the invalid power generation area. Improve the energy density of the module with high-density cell interconnect technology high-density cell interconnect technology on Ultra V module, which can shorten distance between the cells and decrease the invalid power generation area greatly and improves the energy density of the module. The use of flexible special welding strip can mostly assure the reliability of the welding process between the cells, to improve the yield of the product effectively. Lighter and thinner, more than 14% weight reduction Suntech has particularly optimized structure design and own the exclusive patent. The module weighs 27.5 KG, 11% lower than the products of the same specification. The bifacial module adopts 2.0 mm thickness glass on the front and back side, and the mechanical load capacity has increased greatly. When applying +5400/2400 Pa, the maximum structure stress of the module is 23% lower than the conventional structure design. The maximum deformation is 37% lower than the conventional structure, which can effectively decrease any risks. This combined with a transparent backsheet, which not only has high light transmittance and excellent PID resistance, but also reduces 14% of weight compared with double-glass bifacial modules.