Storage server SYS-112C-TN

RAIDnetworkvideo

Virtualization, HPC, CDN, Edge Nodes, Cloud Computing, Data Center Optimized, Storage Headnode, Key Features All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO) Support DC-SCM module with OpenBMC; Single Intel® Xeon® 6 6700 series processor with E-cores; 16 DIMM slots supporting up to 1TB of memory (6700E series CPU); Support FH DPU and single slot GPU; Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible).; Breeze through high throughput workloads with PCIe 5.0 NVMe drive support; Trusted Platform Module (TPM) 2.0 9670 onboard; Form Factor Enclosure: 437 x 43 x 747mm (17.2" x 1.7" x 29.4") Package: (23.8" x 8.1" x 40.6") Processor Single Socket E2 (LGA-4710) Up to 144C/144T; Up to 108MB Cache GPU Max GPU Count: Up to 2 single-width GPUs CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect System Memory Slot Count: 16 DIMM slots/8 Channels Drive Bays Configuration Default: Total 8 bays 8 front hot-swap 2.5" PCIe 5.0 NVMe/SAS*/SATA* drive bays 4 front hot-swap 2.5" SAS*/SATA* drive bays (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details) Expansion Slots Default 2 PCIe 5.0 x16 FHHL slots 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) On-Board Devices NVMe: NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) Chipset: System on Chip Network Connectivity: Via Slim-AIOM Input / Output LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s) Video: 1 Mini-DP port(s) (Rear) TPM: 1 TPM header