Network server SYS-222BT-HNC8R

video2UIntel® Xeon

Container-as-a-Service; Application Accelerator, Diskless HPC Clusters, All-Flash Hyperconverged Infrastructure, Key Features Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling Single CPU configurations supported while maintaining all expansion slot functionality; Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC; Flexible networking with OCP 3.0 AIOM slot; Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 feature via SCC-A2NM2241GH-B1; Up to 6 front hot-swap 2.5" NVMe/SAS drive bays Built-in SAS3 Support via Broadcom 3808; IT Mode; Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:; Form Factor Enclosure: 449 x 88 x 730mm (17.68" x 3.47" x 28.75") Package: 626 x 248 x 1150mm (24.65" x 9.76" x 45.28") Processor Dual Socket E2 (LGA-4710) Up to 144C/144T; Up to 108MB Cache per CPU System Memory Slot Count: 16 DIMM slots Drive Bays Configuration Default: Total 6 bays 2 front hot-swap 2.5" PCIe 5.0 NVMe/SAS drive bays 4 front hot-swap 2.5" PCIe 4.0 NVMe/SAS drive bays M.2: 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID) Expansion Slots Default 2 PCIe 5.0 x16 LP slots 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) On-Board Devices SAS: SAS (12Gbps) via Broadcom® 3808; (IT mode) Chipset: System on Chip Network Connectivity: Via AIOM Input / Output LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s) Video: 1 VGA port(s) System Cooling Fans: 4x 16K RPM Counter Rotating 80x80x56mm Fan(s) Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional)