High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics,
Key Features
32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5;
8 PCIe Gen 5.0 X16 LP
2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional);
Flexible networking options;
2 M.2 NVMe for boot drive only 16x 2.5" Hot-swap NVMe drive bays (12x by default, 4x optional)
3x 2.5" Hot-swap SATA drive bays Optional: 8x 2.5" Hot-swap SATA drive bays;
10 heavy duty fans with optimal fan speed control;
Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level 6x 3000W (4+2) Redundant Power Supplies, Titanium Level;
Form Factor
Enclosure: 437 x 355.6 x 843.28mm (17.2" x 14" x 33.2")
Package: 698 x 750 x 1300mm (27.5" x 29.5" x 51.2")
Up to 64C/128T; Up to 320MB Cache per CPU
GPU Max GPU Count: Up to 8 onboard GPUs
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory Slot Count: 32 DIMM slots
Drive Bays Configuration Default: Total 15 bays
12 front hot-swap 2.5" NVMe drive bays
3 front hot-swap 2.5" SATA drive bays
Option A: Total 19 bays
12 front hot-swap 2.5" NVMe drive bays
4 front hot-swap 2.5" NVMe* drive bays
3 front hot-swap 2.5" SATA drive bays
M.2: 2 M.2 NVMe slots (M-key)
Expansion Slots Default
8 PCIe 5.0 x16 LP slots
2 PCIe 5.0 x16 FHHL slots
On-Board Devices Chipset: Intel® C741
Network Connectivity: 2 RJ45 10GbE with Intel® X550-AT2 (optional)
2 SFP28 25GbE with Broadcom® BCM57414 (optional)
2 RJ45 10GbE with Intel® X710-AT2 (optional)