High Performance Computing, AI/Deep Learning Training, Industrial Automation, Business Intelligence & Analytics, Climate and Weather Modeling, Biomedical, Generative AI, Finance Services and Fraud Detection,
Key Features
High Density Computing: 8 x Intel® Data Center GPU Max 1550 (600W) OAM
Performance: 6.7 petaFLOPS FP16/BF16
GPU Memory: 1TB HBM2
GPU Memory Bandwidth: 3276.8 GB/s
GPU to GPU Interconnect: 742 GB/s XeLink Scale Up Bandwidth Open Ecosystem with oneAPI
Form Factor
Enclosure: 447 x 356 x 843mm (17.7" x 13.8" x 33.2")
Package: 1300 x 700 x 750mm (51" x 27.6" x 29.5")
Processor Dual Socket E (LGA-4677)
Up to 64C/128T; Up to 128MB Cache per CPU
GPU Max GPU Count: Up to 8 onboard GPUs
Supported GPU: Intel OAM: Data Center GPU Max 1550
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect: Intel® Xe Link Bridges
System Memory Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM
Drive Bays Configuration Default: Total 19 bays
3 front hot-swap 2.5" SATA drive bays
16 front hot-swap 2.5" NVMe drive bays
M.2: 2 M.2 NVMe/SATA slots (M-key 2280/22110)
Expansion Slots Default
8 PCIe 5.0 x16 LP slots
4 PCIe 5.0 x16 FHHL slots
On-Board Devices Chipset: Intel® C741
Network Connectivity: 2 RJ45 10GbE with Intel® X550-AT2 (optional)
Input / Output LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s)
Video: 1 VGA port(s)