High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics,
Key Features
8 PCIe Gen 5.0 X16 LP
2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional);
Flexible networking options;
2 M.2 NVMe for boot drive only Optional: 8x 2.5" Hot-swap SATA drive bays
8x 2.5" Hot-swap NVMe drive bays;
4 heavy duty fans with optimal fan speed control;
4x 5250W(2+2) Redundant Power Supplies, Titanium Level;
Form Factor
Enclosure: 449 x 174 x 842mm (17.7" x 6.85" x 33.2")
Package: 1216 x 330 x 670mm (48" x 13" x 26.4")
Processor Dual Socket E (LGA-4677)
Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
64C/128T; 320MB Cache per CPU
GPU Max GPU Count: Up to 8 onboard GPUs
Supported GPU: NVIDIA SXM: HGX H100 8-GPU (80GB), HGX H200 8-GPU (141GB)
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory Slot Count: 32 DIMM slots
Drive Bays Configuration Default: Total 8 bays
8 front hot-swap 2.5" NVMe drive bays
M.2: 2 M.2 NVMe slots (M-key)
Expansion Slots Default
8 PCIe 5.0 x16 LP slots
2 PCIe 5.0 x16 FHHL slots
Option A
8 PCIe 5.0 x16 LP slots
4 PCIe 5.0 x16 FHHL slots
On-Board Devices Chipset: Intel® C741
Network Connectivity: 2 SFP28 25GbE with Broadcom® BCM57414 (optional)
2 RJ45 10GbE with Intel® X710-AT2 (optional)
Input / Output 1 VGA port(s)
System Cooling Fans: 4 Fan 8cm Fan(s)
Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional)
Power Supply 4x 5250W Redundant Titanium (certification pending) Level (96%) power supplies
System BIOS BIOS Type: AMI 32MB SPI Flash EEPROM