UV laser marking and engraving machine

metalplasticglass

metals, sapphire, glass, diamond, polyamides, PCBs, coatings, ITO removal, silicon wafers, ceramics, plastics, fiber, paper, polyimides, etc The UV laser marking machine uses a 355 nm wavelength UV laser with a "cold marking" method. The laser beam diameter is only 20 μm after focusing. The UV laser's pulse energy comes in contact with the material in the microsecond. There is no significant thermal influence next to the slit, so no heat damages the electronic component. - With cold laser processing and a small heat-affected zone, it can achieve high-quality processing - Wide applicable materials range can compensate for the shortage of infrared laser processing ability - With good beam quality and a small focusing spot, it can achieve superfine marking - High marking speed, high efficiency, and high precision - No consumables, low cost and low maintenance fee - The overall machine has stable performance, supporting the long-term operation Application and Samples - UV laser marking of electronic products' LOGO, model, place of origin - UV laser marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm - PCB laser marking, PCB laser depaneling, PCB laser singulation - Removal of metal or non-metallic coatings - Silicon wafer micro-hole and blind hole laser processing - Laser marking of low-voltage apparatus and refractory materials