SYS-CLEAN© STC1.0 is a water-based cleaning medium for cleaning SMT stencils already at room temperature.
SYS-CLEAN© STC1.0 reliably cleans solder pastes from stencils and misprints.The cleaner can be used in spray processes as well as in immersion or ultrasonic systemswill be.
Advantages: SYS-CLEAN© STC1.0 is very well filterable and has an optimized discharge behaviour which reduces consumption and prevents oily residues. The high loading capacity ensures a particularly cost-effective process. Since the medium does not separate, use in underside cleaning is possible without problems.