Status - Mass Production (Preferred)
Case Size (EIA/JIS) - 01005/0402
tanδ (max) - 5 %
Temperature Characteristic (EIA) - X7R
Operating Temp. Range (EIA) - -55 to +125 ℃
High Temperature Loading
(% Rated Voltage) - 200 %
Insulation Resistance (min) - 10,000 MΩ
Dimension L - 0.4 ±0.02 mm
Dimension W - 0.2 ±0.02 mm
Dimension T - 0.2 ±0.02 mm
Dimension e - 0.10 ±0.03 mm
RoHS Compliance (10 subst.) - Yes
REACH Compliance (235 subst.) - Yes
Soldering - Reflow
Standard Quantity - Taping Embossed 40000pcs
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
The use of nickel as electrode material and plating processing improve the solderability
and heat resistance characteristics. It also prevents migration and raises the level
of reliability.
Low equivalent series resistance(ESR) provides superior noise absorption characteristics
Main Applications
Communication equipment
(cellular phone, wireless applications, etc.)
General digital circuit
Power supply bypass capacitors
Liquid crystal modules
Liquid crystal drive voltage lines
LSI, IC, converters (both for input and output)