Status - Mass Production (Preferred)
Case Size (EIA/JIS) - 0805/2012
tanδ (max) - 20 %
Temperature Characteristic (EIA) - X6S
Operating Temp. Range (EIA) - -55 to +105 ℃
High Temperature Loading
(% Rated Voltage) - 100 %
Insulation Resistance (min) - 100 MΩ・µF
Dimension L - 2.0 +0.20/-0.00 mm
Dimension W - 1.25 +0.20/-0.00 mm
Dimension T - 1.25 +0.20/-0.00 mm
Dimension e - 0.50 ±0.25 mm
RoHS Compliance (10 subst.) - Yes
REACH Compliance (240 subst.) - Yes
IEC62474 (Ver. D28.00) Compliance - Yes
Halogen Free - Yes
Soldering - Reflow
Standard Quantity - Taping Embossed 3000pcs
Features
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
The use of nickel as electrode material and plating processing improve the solderability
and heat resistance characteristics. It also prevents migration and raises the level of reliability.
Low equivalent series resistance(ESR) provides superior noise absorption characteristics
*Please check the individual product specification sheets for details.
Main Applications
Mobile Devices
Mobile Phone
Smartphone, etc.