Status - Mass Production (Preferred)
Case Size (EIA/JIS) - 1210/3225
tanδ (max) - 10 %
Temperature Characteristic (EIA) - X6S
Operating Temp. Range (EIA) - -55 to +105 ℃
High Temperature Loading
(% Rated Voltage) - 150 %
Insulation Resistance (min) - 100 MΩ・µF
Dimension L - 3.2 ±0.30 mm
Dimension W - 2.5 ±0.30 mm
Dimension T - 2.5 ±0.30 mm
Dimension e - 0.60 ±0.30 mm
RoHS Compliance (10 subst.) - Yes
REACH Compliance (240 subst.) - Yes
IEC62474 (Ver. D28.00) Compliance - Yes
Halogen Free - Yes
Soldering - Reflow
Standard Quantity - Taping Embossed 1000pcs
Features
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
The use of nickel as electrode material and plating processing improve the solderability
and heat resistance characteristics. It also prevents migration and raises the level of reliability.
Low equivalent series resistance(ESR) provides superior noise absorption characteristics
Main Applications
Communication equipment
(cellular phone, wireless applications, etc.)
General digital circuit
Power supply bypass capacitors
Liquid crystal modules
Liquid crystal drive voltage lines
LSI, IC, converters (both for input and output)
Smoothing capacitors
DC-DC converters (for both input and output)
Switching power supplies (secondary side)