Solder paste AP series

coppersilver basedfor electrical components

TAMURA ELSOLD® solder pastes feature outstanding wetting properties across a wide range of temperatures. Because of this, our solder pastes offer first-rate slump characteristics and excellent adhesive qualities. The use of chemically modified materials makes the pastes extremely reproducible, which delivers tangible user benefits in the form of consistent print results from board to board. Further benefits include minimal shrinkage, high printing speeds and high activity on all surfaces. TAMURA ELSOLD® solder pastes are ideal for closed chamber doctor blade systems and for fine-pitch printing.