Flip-chip die bonder AFM Series

TDK uses its abundant experience and technology that it has accumulated to propose a new mounting method for the next generation. TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process). Low-energy bonding enables bonding with 30% to 50% less energy consumption than other companies' products