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Polyimide adhesive
single-componenthot-melthigh-temperature

polyimide adhesive
polyimide adhesive
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Characteristics

Chemical composition
polyimide
Number of components
single-component
Technical characteristics
hot-melt, high-temperature
Applications
for electronics, for printed circuit boards, medical, for coils

Description

Characteristics of Polyamide Hot Melt Glue Stick : 1. High bonding strength and wide bonding materials 2. Halogen-free Hot Melt Adhesive that is in Compliance with UL94V0 flame retardant 3. High Temperature Resistant 4. Compliance with ROHS 5. Great operational performance & cost saving 6. Excellent Dielectric property of Electric Appliance 【Polyamide Hot Melt Glue Stick 】Main Application: ● Electrical and electronic products : power supplies, audio, printers, air conditioners, refrigerators, medical machines, etc. ● Fixing and filling of PCB components : capacitors, inductors, coils, cables, jumpers, etc. Heat resistant polyamide hot melt glue stick can provide electronic components the function of fastening, reinforcement, protection, shake proof, insulating, and sealing.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.