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Multilayer printed circuit board
for communication module8 layers

Multilayer printed circuit board - TIANJIN PRINTRONICS CIRCUIT CORPORATION - for communication module / 8 layers
Multilayer printed circuit board - TIANJIN PRINTRONICS CIRCUIT CORPORATION - for communication module / 8 layers
Multilayer printed circuit board - TIANJIN PRINTRONICS CIRCUIT CORPORATION - for communication module / 8 layers - image - 2
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Characteristics

Options
multilayer
Applications
for communication module
Number of layers
8 layers

Description

Layer: 8 Board Thickness: 1.2mm Min. Line/Space: 0.1/0.1mm Surface: OSP

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