Surfacing wheel Vega

finishingcylindricalvitrified-bonded diamond

Diamond grinding wheel for coarse & fine grinding of SiC wafers in longer life with reasonable cost. *Work materials: Semiconductor wafer (SiC, GaN, GaAs, LT/LN) *Application: Wafer grinding / Back grinding (Coarse & Fine grinding) [Specifications] *For coarse grinding Diamond type: Synthetic diamond Bonding: Porous vitrified bond Abrasive grain size: Up to #4000 Concentration ratio: Up to 120 Tooth width: 2 - 4mm Tooth height: Up to 6mm Outer diameter: Up to 350mm *For Fine grinding Diamond type: Synthetic diamond Bonding: Porous vitrified bond Abrasive grain size: #5000 - #12000 Concentration ratio: Up to 120 Tooth width: 2 - 4mm Tooth height: Up to 6mm Outer diameter: Up to 350mm Our porous vitrified bond wheel "VEGA" has both larger pore diameter and higher porosity than conventional wheels, maximizing the biting performance to work materials. It is particularly suitable for wafer/back grinding of SiC wafers and can grind 6" SiC wafers without dressing. The excellent wear resistance increases the number of wafers that can be machined per wheel and contributes to the reduction of wafer machining costs.