Notching grinding wheel

cylindricalmetal-bonded diamondfor wafers

Notch wheel for semiconductor wafers Metal bond notch wheel for semiconductor wafers *Work materials: Semiconductor wafers(Silicon, SiC, GaAs, Sapphir etc)e *Application: Notch grinding [Specifications] Grain size : #400 - #3000 Outer diameter : Up to 4D (Min 2D) Shank diameter tolerance: h6 Total length : Up to 35L Deflection accuracy : ≧ 5 um @Min. Groove shape tolerance : ≧ 1 degrees @ aperture angle Number of grooves : Up to 5 grooves This diamond wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology & high precision diamond wheel part against the shank bring the less run-out. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror edge grinding are also available. Longer life of finishing notch wheels for silicon wafers [Issue] The demand for quality in the notch area of silicon wafers has been increasing year by year, and the notch wheel abrasive grains with a higher grain size number are increasingly being used. [Solution] Although the life of the notch wheel tends to become shorter due to the higher grain size number, the life can be enhanced by improving the hardness and strength of the notch wheel bond. In addition, the use of our original dressing technology AD-C allows for further improvement in service life. We can provide notch wheels that are compatible with various types of wafers, including compound semiconductors. We are also working on the development of high-precision beveling wheels and notch wheels for silicon wafers.