video corpo

Quality control system RD-MC
thicknessprocess

quality control system
quality control system
Add to favorites
Compare this product
 

Characteristics

Function
process, quality, thickness

Description

Delivers variable-depth milling and variable-thickness paving Eliminates the need for bulky averaging skis Accounts for differential compaction Provides consistent smoothness for miles of paving or milling Maximizes man hours and materials Eliminates the need for rework Achieves rideability and satisfies strict DOT and regulatory guidelines Breakthrough technology for smooth paving and milling This complete solution is revolutionizing the road resurfacing industry. The modern RD-MC system fully maximizes the capabilities of our 3D-MC technology and delivers better results throughout the paving and milling process. You save time, lower costs, and increase safety. The system is built on our industry-leading sonic tracker for tight vertical control and GNSS to deliver deliberate positional guidance. This fusion of technology provides the most versatile solution to accurately place or remove variable amounts of asphalt according to the design - the modern way to pave or mill. RD-MC is perfect for mainline paving or milling projects with long sections of road that need to be resurfaced. You’ll stay productive, ahead of schedule, and substantially improve material management. Save time, reduce equipment, achieve rideability Traditional methods to achieve smoothness are no longer providing the quality control often desired by regulatory authorities. Our RD-MC system utilizes rugged hardware with intuitive software for a complete solution that is customizable for success.

Catalogs

No catalogs are available for this product.

See all of TOPCON‘s catalogs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.