Automatic wire bonder HB16

with motorized Z- & Y - Axes Our goal is to support developers in realizing new ideas and applications for microelectronics. Our customers are startups, universities and large corporations, in more than 40 countries around the globe. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time. One Bond Head for Wedge, Ball, Bump, & Ribbon With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time. Deep & Wide Bond Access - Ample work- space due to Special Bond Head Design We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.