Automatic wire bonder HB30

Heavy Wire Bonder With motorized Z- & Y- Axes Our goal is to support developers in realizing new ideas and applications for microelectronics. We developed the HB30 for applications with higher energy needs. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time. 2000µm Heavy Ribbon bonding Our HB30 can work with the most unusual wires to your satisfaction. Smaller production units are no problem at all. Deep & Wide Bond Access Ample workspace due to Special Bond Head Design We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. This unique combination is the key to access narrow spaces directly in the housing of your application.