Treks Model 645 software-driven Electrostatic Chuck Supply offers an array of features that provide significant benefits while accommodating a variety of demanding applications. Documented use shows that customers have seen increases in efficiency and throughput equal to three times that of other supplies. Additionally, the Model 645 virtually eliminates sticky wafer and wafer popping issues, thus ensuring better control over particle contamination.
Given the versatility and performance of the Model 645, it can be used in multiple unique tools/processes, thus eliminating the need to specify a new supply for each unique tool/process in a facility.
Key Specifications
Output Phasing:
Voltage A (Reference Phase): 0 to ±2 kV
Voltage B (Phase B = [-1] x Phase A): 0 to ±2 kV
Output Voltage Range: 0 to ±2 kV
Output Current Range: 0 to ±6.5 mA DC with a peak capability of 10 mA
Typical Applications Include
Electrostatic-driven handling of materials
Semiconductor wafer processing
Non-mechanical transfer of flat panels or other processing materials sensitive to mechanical clipping
Features and Benefits
Supports both Coulombic and Johnsen-Rahbek ESC technologies
User configurable for custom clamp and declamp sequences and wave shapes
Electrostatic chuck profiles can be uploaded to the unit and stored internally via a user-friendly software interface
Documented reduction of backside gas errors, increased throughput, and elimination of sticky/popping wafers
Lockable front panel control interface
Ability to control parameters such as over-current, wafer-present and wafer-clamped thresholds, clamp voltage,