Xilinx® Zynq® Ultrascale+™ CPU module TE0813-01-3BE11-A

rugged

The Trenz Electronic TE0813-01-3BE11-A is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ with ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants. All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options. Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E ZU3EG, 784 Pin Packages Dimensions: 5.2 x 7.6 cm Plug-on module with 4 x 240 pin B2B connectors Rugged for shock and high vibration 3 mm mounting holes for skyline heat spreader 2 GByte (64-bit width) DDR4 SDRAM 128 MByte QSPI Boot Flash dual parallel 2 Kbit serial EEPROM with EUI-48 Node Identity Graphic Processing Unit (GPU) User I/O 65 x multi-use I/O's (MIO) 48 x high-density (HD) I/O's (2 banks) 156 high-performance (HP) I/O's (3 banks) Serial transceiver: PS GTR 4 Programmable 4-channel PLL clock generator All power supplies on board Single 3.3V power source or 5V and 3.3V standby power sources required Evenly spread supply pins for good signal integrity