The TR7007Q/QI Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007Q/QI Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007Q/QI Plus is equipped with up to 4 projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends.
• Closed Loop Ready: Feedback and Feedforward Capabilities.
Imaging Method - Stop-and-Go Imaging
Imaging Resolution - 5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
Lighting - Enhanced 2D Lights (RGB+W)
3D Technology - 4-way Digital Fringe Pattern
Field of View - 4 MP Camera Link-
@ 10 μm: 20.3x20.3 mm
@ 15 μm: 30.5x30.5 mm
12 MP Camera Link-
@ 5.5 μm: 22.5x16.5 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm
12 MP CoaXPress-
@ 6 μm: 24.3x18.4 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm