The TR7600 SV series is the newly released line scan 3D AXI, offering up to a 20% performance improvement compared to the award-winning TR7600 SIII series. Powered by AI algorithms, this high-speed 3D AXI can precisely detect void defects. With a high resolution of 7 µm, the TR7600 SV series delivers high-yield-rate inspection.
The robust platform is capable of fast image reconstruction and defect detection in BGAs, Barrel fill, Capacitors, Chips, Components Under RF shields, CSPs, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.
• 7 µm High Performance Inspection, 20% Performance Improvement compared to previous model
• New motion controller, EtherCAT, for real-time measurements and ease of maintenance
• AI-Powered Inspection algorithms for precise defect detection
• Smart Factory Ready for Easy MES Connectivity
• Worldwide Technical Support Services
Imaging System
Camera - Ultra-High Speed Line-Scan CCD 3 or 5 Units (9 or 15 Sensors)
X-ray Source - 60 -130 kV
Imaging Resolution - 7 μm - 25 μm
Inspection Method - 2D, 2.5D, 3D Slicing, Planar CT (Optional)