Plasma PCB etching machine SIRUS T2

for printed circuits

The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment. Applications MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line. Fluorine Etch Processes (SF6, CF4, CHF3, O2) • Carbon• Si • Epoxy• SiO2 • InSb• Si3N4 • Ir• SiC • Mo• Ta • Nb• TaN • OxyNitride• TiW • Polyimide • TiN • Pr (e.g: SiLK or SU8)• W • Quartz Tool Standard Features Sirus T2 reactor with 200mm bottom electrode System controller (includes Pentium™ based computer and touch screen interface) Two mass flow controllers Automatic tuning with 13.56 MHz 600 watt RF generator Emergency Off system Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement) 12 month limited warranty Optional Features Recirculating temperature controller Up to two additional mass flow controllers Pumps 170 l/s turbo 23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 M ohm resistivity.