Adhesive application head module H300 Multifit
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Description
The UES high precision module H300 is well suited for standard application of glue at normal application speed. The module processes glue with a viscosity up to 20,000mPas/s at a maximum switching speed of 4,000p/min (depends on the triggering). For fast openings air pressure is applied to the module.
The module is best for standard dot or bead applications.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.