Adhesive application head module H300 slot nozzle (BS)

The UES high precision module H300 is well suited for standard application of glue at normal application speed. The module processes glue with a viscosity up to 20,000mPas/s at a maximum switching speed of 4,000p/min (depends on the triggering). For fast openings air pressure is applied to the module . Slot nozzle modules are designed to fit ideal to the applicator body. Because in most cases several modules are mounted to one body it is necessary to adjust the glue application with each module. The integrated fine adjustment makes it easy to define the glue application of each module separately.