Adhesive application head module H300

The UES high precision module H300 is well suited for standard application of glue at normal application speed. The module processes glue with a viscosity up to 20,000mPas/s at a maximum switching speed of 4,000p/min (depends on the triggering). For fast openings air pressure is applied to the module . The spray module has an additional input for compressed air. Once the air escapes through the symmetrically arranged bore holes constant glue swirling is provided. The modules are used on glue applicators with integrated heat exchanger. The sprayed glue has a sharply edge and is scarcely visible.