Lithography system for the semiconductor industry Ultratech AP200/300

AP200/300 Projection Steppers The AP200/300 family of lithography systems is built on Veeco’s customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost- effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Veeco’s award-winning dual-side alignment (DSA) system, utilized around the world in volume production. Key Features 2 µm resolution broadband projection lens designed for Advanced Packaging applications Exposure wavelength from 350 – 450 nm to handle a wide range of Advanced Packaging photosensitive materials Programmable wavelength selection (GHI, GH, I) for process optimization and process latitude High intensity illumination provides superior system throughput Large Depth-of-Focus for thick resist processes and large wafer topography High system throughput for favorable system cost of ownership High intensity illumination reduces exposure time Field size of 68 by 26mm exposes two scanner fields, reducing number of exposure steps per wafer Fast system stage and wafer input/output systems to minimize handling time Flexible Alignment system with self metrology capability Patented Machine Vision System (MVS) alignment capability eliminates the need for dedicated alignment targets and simplifies process integration