Chassis-mounted DC/DC converter BCM6135CD1E5165T00
high power densityregulatedCE

Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE
Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE
Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE - image - 2
Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE - image - 3
Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE - image - 4
Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE - image - 5
Chassis-mounted DC/DC converter - BCM6135CD1E5165T00 - VICOR - high power density / regulated / CE - image - 6
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Characteristics

Configuration
chassis-mounted
Electrical characteristics
regulated, high power density
Other characteristics
CE
Input voltage

384 V

Output voltage

48 V

Power

3,400 W

Description

The CM-ChiP BCM is a high-efficiency Bus Converter, operating from a 260 – 410VDC high-voltage bus to create an isolated ratiometric 32.5 – 51.3VDC low-side bus. This ultra-low-profile module is available in a chassis-mount form factor, incorporates a fixed-ratio DC-DC converter and PMBus commands and controls. The BCM provides low output impedance, low noise, fast transient response, high efficiency and high power density. A low-voltage-side-referenced PMBus-compatible telemetry and control interface provides access to the BCM’s configuration, fault monitoring and other telemetry functions. Owing to its megahertz bandwidth and low series impedance, the BCM performs as an efficient capacitance multiplier, enabling bulk capacitance across the 48V bus to be scaled down by a factor of 1/64 across the 384V bus. Capacitance multiplication cuts down the size and number of capacitors required by 48V PoL regulators while freeing up real estate at the point-of-load. The CM-ChiP BCM module offers flexible thermal management options, with very low top- and bottom-side thermal impedances. Thermally-adept CM-ChiP-based power components enable customers to achieve low-cost power system solutions with previously unattainable system size, weight and efficiency attributes.

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