Brazing paste inspection device iS6059 SPI

quality

Viscom’s powerful SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately examined. The 3D inline system demonstrates decades of Viscom's experience in reliable, high-throughput solder paste inspection. The latest sensor technology with an orthogonal camera and four lateral views results in the highest inspection quality. Realistic color images ensure quick and clear verification. The FastFlow handling guarantees an extremely high throughput thanks to synchronous in- and outfeed of the assemblies. The system can achieve minimal handling times with minimal mechanical impact loads. Intelligent networking in the SMT line enhances process stability and efficiency. • Excellent defect identification for ultimate reliability • Cutting-edge 3D camera technology • High inspection speed • Fast handling of PCBs • End-to-end process analysis with Viscom Quality Uplink • Closed-loop functions enhance quality and efficiency • Integrated verification • Flexible integration into existing productions • Improved ergonomic design