With innovative 3D camera technology, the iS6059 THT Inspection 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and at high precision on the underside of the printed circuit board. PCBAs as well as inspection objects on workpiece carriers are inspected at high speed in 2D, 2½D and 3D. As a result, the iS6059 THT Inspection stands for maximum defect detection and highest throughput. Different lighting can be used flexibly and so provide inspection results in excellent quality.
• Maximum performance: Featuring a powerful 3D XM sensor system concept for performing quality inspections from below
• First-rate inspection quality: Shadow-free inspection thanks to 8 angled cameras
• System flexibility: reliable handling of a wide range of different inspection objects
• Optimum process design due to extended handling possibilities such as long board option
• Minimal time and training requirements thanks to Viscom standard software
• Flexible integration into existing productions
• Improved ergonomic design
CONNECTIVITY
• Global libraries, global calibration: Transferability to all systems
• Outstanding inspection program optimization thanks to flexible single and multiline verification solutions
• Simple operation and inspection program generation with EasyPro/vVision
• High-performance OCR software
• Connection via horizontal interfaces along the production line
• Viscom Quality Uplink: intelligent networking of Viscom inspection systems along the production line
• Production line control and product traceability