The X7056-II's state-of-the-art X-ray technology ensures precise inspection of high-end electronics. The inline X-ray system has won five international awards for its extremely high throughput and outstanding image quality. Even concealed solder joints and components are displayed as crystal-clear slice images to guarantee seamless quality control. The option to also integrate AOI inspection within the system and to perform combined inspections is a special feature of the X7056-II – an efficient, space-saving highlight that provides fast and comprehensive inspection results.
• System can be used as a 3D AXI system or combined 3D AXI / 3D AOI
• Revolutionary xFastFlow handling concept for changing printed circuit boards in as little as 4 seconds
• Ultra-thorough inspection of single or double-sided electronic assemblies
• Three different flat panel detector sizes for scalable throughput
• Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
• Maximum inspection program optimization through integrated verification
• Additional vertical slices for optimum analyses and dependable verification
• High-quality 3D AXI volume calculation with planar CT