X-ray inspection system iX7059

3D2DCT

Large, heavy, and solid assemblies – whether encased or as complete models – require 100% quality assurance, depending on the area of application. As a result, perfect-fit inline X-ray inspection in 2D, 2.5D, or 3D is the first choice for high current and high voltage electronics. This is because inspected components and flawless solder joints are the only way to guarantee the necessary functional reliability in cases where, for example, critical solder joints that have air inclusions of an excessive number or size could jeopardize heat dissipation in power electronics and lead to overheating. With its iX7059 product line, Viscom is setting a new standard for fast, high-precision inline X-ray inspection. The special transport system enables seamless handling of inspection objects on workpiece carriers or in soldering frames with a weight of up to 40 kg – a unique feature that offers huge advantages for trending segments such as e-mobility, new energies, and telecommunications. • Reliable inspection for heavy, solid, and encased components • Powerful X-rays with 130 kV or optionally 160 kV • One-of-a-kind transport concept for fast handling of workpiece carriers and soldering frames • Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library • Maximum inspection program optimization through integrated verification • Additional vertical slices for optimum analyses and dependable verification