X-ray inspection system iX7059

3Dqualityfor defect detection

With its iX7059 product line, Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards. Outstanding inspection performance for SMD and THT solder joints as well as exact measurement of voids deliver 100% quality assurance in modern SMT production, so that hidden defects can be detected even when complex assemblies cause massive shadowing effects. In addition to traditional SMD inspection, the compact iX7059 PCB Inspection or iX7059 PCB Inspection XL 3D AXI system also provides high-precision, reliable inspection of soldering defects such as head-in-pillow and pores in BGA and LGA components. Cutting-edge, powerful microfocus X-ray technology, new dynamic 3D image acquisition methods and seamless handling guarantee the best throughput rates. The iX7059 PCB Inspection XL with extended longboard option comes into play for especially large PCB assemblies measuring up to 1,600 mm – this solution is ideal for server boards, LEDs, semiconductors and 5G electronics. • Seamless, perfect handling of PCB assemblies – even for very large PCBs measuring up to 1,600 mm • Unbeatably fast dynamic image acquisition concept Evolution 4 or optionally 5 for even more speed and the highest throughput • Additional vertical slices for optimum analyses and dependable verification • Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library • Maximum inspection program optimization through integrated verification