Soldering iron tip RTU series

Thermal Core Technology for optimized heat transfer Made for high performance and heavy duty applications (LED soldering, Solar technology, Electronic components, Multi-layer boards, Large heat sinks, Hyper frequency PCB with a big dissipater) MIL-SPEC / IPC standard RT Ultra Soldering Tips for WXUP Soldering Irons Designed for heavy duty applications and large components Benefits Patented Thermal Core Technology Optimized thermal heat transfer to the solder joint. Consistent soldering for reduced rework. MIL-SPC / IPC standard Reduces risk of damage to sensitive components and workpieces. No rework, lower total cost of ownership Active tip technology Fastest heat-up and recovery time, sensor close to the solder tip, excellent heat transfer. No downtime, continuing workflow, excellent results Digital tool for data storage Motion activated usage sensor for energy control and data storage Patented tip & grip design Only soldering tip on the market which can be changed without a tool. 20% faster change than leading competitors.