Copper protective foam WF10001 series

Item Copper Foam Item Number WF10001C Specification 　 Description The technology of producing copper foam by Shanghai Winfay is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics sector.Copper Foam are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers. Below is the conventional evaluation of copper foam made by Shanghai Winfay. Porosity: 5—120 PPI (pores per inch) Density: 0.15~0.45g/cm3 Cavity: 90%—98% Element: Cu+Ni, Cu+Al, Cu+Zn Volume: 600×500×1—100mm Feature: 1. Excellent mechanical property and processability; 2. Extraordinary electricity and heat conductivity; 3. Massive intricate, lattice-like inner structure 4. The excellent ability of corrosion resistance, superior tensile strength, favorable ductility; 5. Magnificent electromagnetic shielding ability. Special specification are available upon request.