Spray cleaning tunnel DESMEARSTAR

immersionprocessfor the chemical industry

DESMEARSTAR is a range of CHEMSTAR modular series made of Polypropylene and Stainless Steel AISI 316 Modules for the combination of Lines in the fabrication of printed circuit boards. This series is a combination of horizontal Chemical Spray, Chemical Immersion and Rinse modules for Desmear process lines for cleaning blind via and drilled holes to create the right roughness on resin surface of the innerlayer, multilayer and double side pcb’s. The Desmear process is a combination of three different steps: Conditioner “Sweller” to soften the resin and clean holes from drill dust with help of Ultrasonic and Forced Fluid Flow Manifold Technology. Permanganate to smear completely the glass fibres from epoxy resin on the surface with help of Ultrasonic and Forced Fluid Flow Manifold Technology. Neutralizer an acid solution to neutralize the excess of permanganate solution. This series is available to accommodate panel widths of 650 (25,5”) and 760mm (30”). Chemstar series can process panel from 0,5 to 5 mm (.020” to .200”) thickness as a standard, but can easily works with boards down to 0,05 mm. (.002”) using the Thin Material System or up to 12,7 mm. (.500”) with the Thick Board Option. The machine has a self supporting structure totally constructed in the same materials and is available from left to right conveyor direction or mirror version.