Water cleaning tunnel PLATESTAR

sprayimmersionautomatic

PLATESTAR is a range of CHEMSTAR modular series made of Polypropylene and Stainless Steel AISI 316 Modules for the combination of Lines in the fabrication of printed circuit boards. This series is a combination of horizontal Chemical Spray, Chemical Immersion and Rinse modules for Direct Plating & Electroless processes lines for generating conductivity in though hole, blind via and dielectrics. The Direct Plating process utilizes different methods and materials, like GRAPHITE, PALLADIUM or CONDUCTIVE COLLOIDS with proprietary additives used to make through-holes and blind vias, conductive for subsequent copper electroplating. ELECTROLESS COPPER is a similar process as deposition of flash of copper into through-holes and blind vias, for the following copper electroplating. All of these processes is a combination of different steps in relation of the specification of the chemistry used. Platestar range is suitable to meet all the specification of these processes. This range is available to accommodate panel widths of 650 (25,5”) and 760mm (30”). Platestar series can process panel from 0,5 to 5 mm (.020” to .200”) thickness as a standard, but can easily works with boards down to 0,05 mm. (.002”) using the Thin Material System or up to 12,7 mm. (.500”) with the Thick Board Option. The machine has a self supporting structure totally constructed in the same materials and is available from left to right conveyor direction or mirror version.