Thermal imaging micro camera module TIMO series

for wafersdigitalimage processing

Thermal Imaging Module The wafer-level package infrared module integrates wafer-level optical lens, wafer-level package detector, and basic imaging processing circuit to achieve accurate temperature data and sharp images for each pixel in the full frame, enabling easy integration into mobile terminals or smart devices, especially innovative products with strict requirements on cost, size and weight. Low cost, fast integration •Minimum WLP infrared module •DVP Interface, compatible with various embedded platforms •Visible camera module equivalent, directly integration •Complete SDK development kit Extend longer operating time •Low-power design, lowest to 10mW • Detector type : WLP VOx • Infrared resolution : 120 × 90 • Pixel Pitch : 17 μm • Wavelength range : 8 to 14 μm • Field angle : 50°±1°/ 90°±5° • NETD : ≤60 mK • Infrared frame rate : 25 Hz (Customizable, 1-30 Hz) • Focusing mode : Focus-free