Digital camera module COIN412/R

thermalimage processinginfrared

WLP+ASIC Uncooled Thermal Modules COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications. 400x300IR resolution 12μm Pixel Pitch ＜3s Start-up Time ＜40mKNETD （1）“Minimum size and weight” • Dimension 20mm*20mm*10.4mm，Weight＜8g. （2）“Sharp image presentation” • NETD＜40mK； • NUC、IDE、AGC intelligient algorithm. （3）“Fast integration • DVP/LVDS interface，raw/YUV image data output, serial port control.