Differential pressure sensor BW-MD

siliconfor the aeronautical industryfor the petrochemical industry

Beiwei BW-MD series of highly stable monocrystalline silicon sensor chips have been put into the international market in batch, and have been widely used in petrochemical, metallurgy and electric power, industrial automation, aerospace, Internet of Thi -High purity monocrystalline silicon material BW-MD series monocrystalline silicon chips are made of ultra-high purity monocrystalline silicon, which is superior to the composite and diffusion silicon materials commonly used in the market. With this, Beiwei also breaks the pattern that this material is monopolised by only a few excellent sensor companies in the world. -Double Beam MEMS Design Beiwei BW-MD series monocrystalline silicon sensor chip adopts the classic Wheatstone bridge principle, but innovatively adopts dual Wheatstone bridges in the bridge design to realise a "double beam" on the bridge. The double-beam bridge circuit, with complementary temperature characteristics of the bridge resistance, achieves self-compensation when the bridge circuit undergoes self-heating changes or noise interference, which significantly improves the chip's anti-interference capability and long-term stability. -Suspended MEMS structure BW-MD series monocrystalline silicon sensor chips are made of all monocrystalline silicon, the sensing layer and the base layer are bonded with silicon-silicon to improve the hydrostatic characteristics of the chip (much better than the traditional silicon-glass bonding), and at the same time, a suspension layer of inert material with μm thickness is added between the sensing layer and the base layer to greatly reduce the impact of stress and improve the insulating characteristics.