Bonding system FOG

This equipment is used for general glass, special-shaped glass. The main functions are as follows: 1) After discharge of the COG Bonding device;2) A device with Edge Clean (option), ACF attachment, FPC (COF) false pressure and FPC (COF) self pressure; 3) To bond according to the positions of panel and FPC (COF);4) FOG Bonding will be discharged to AOI device after completion. Applicable size: 10.1-21 inches (depending on customer requirements) Applicable shape: ordinary glass, special-shaped glass; Equipment compaction precision: ±0.007mm; External dimension: L x W x H: 4000x2100x1650mm (including Edge Clean part); Power supply: AC220V, 13.5KW; Equipment CT: 15s/1 piece (related to the time of local pressure, the site can be increased or decreased to shorten the beat according to customer requirements); Clean Glass The glass is transferred to the Edge Clean platform from the front work station. The Camera of the Edge Clean department takes pictures of the glass Mark alignment. After the platform is adjusted, the glass is cleaned. ACF Stick Load transfer 1. The glass on the Buffer is transferred to the ACF platform, and the camera in the ACF section shoots the glass Mark alignment. After the platform adjusts the position, the ACF will be affixed to the platform. False Compression Load shifting 2 transfers the glass on the ACF platform to the false pressing platform. At the same time, the FPC moving and sending institution transfers the FPC to the false pressing head, which adsorbs the FPC. The false pressing head camera shoots the glass Mark and FPC for counter-position, and presses the platform after adjusting its position.